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ZMXM-400 Series
PROCESSING (Continued)
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
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Proper alignment and centering of the module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presents of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350oC, follow IPC recommendations/
reference document IPC-7711.
Rework
Matrix Modules can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Warning - Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous ground pins at the module perimeter should be sufficient for optimum
immunity to external RF interference.
Conformal Coating
Conformal coating may be necessary in certain applications. Please note that the RF shield and the sticker prevent
optimum inflow of liquids or aerosols.
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